AdresseSpire Global is a space-to-cloud analytics company that owns and operates the largest multi-purpose constellation of satellites. Its proprietary data and algorithms provide the most advanced maritime, aviation, and weather tracking in the world. In addition to its constellation, Spire's data infrastructure includes a global ground station network and 24/7 operations that provide real-time global coverage of every point on Earth.
As a Senior Spacecraft Electronics Engineer, you will be designing and integrating custom components for our next-generation satellite platform.
This includes the design of PCBAs; the selection, evaluation, and integration of various off-the-shelf components and custom sensors, radios, and power systems; making last-minute fixes; working with third-party fabricators and assemblers; and interfacing with the software and mechanical teams. You may also participate in guiding software and mechanical design and may be involved at any stage of development including proof of concept to new product introduction.
What You'll Do:
- Electrical Design of Spacecraft electronics including requirement gathering, architecture and detailed design.
- Component selection and circuit level design and simulation where required; including transceivers and antennas.
- Schematic capture and PCB Layout using Altium Designer.
- Power supply and power monitoring circuit design.
- Design verification through circuit simulations, including worst-case analysis
- Signal and Power integrity simulation and analysis.
- Peer review of schematics and layouts
- Board bring-up, verification and debugging
- Lead the validation and qualification process for testing new and existing systems
- Assisting and mentoring other team members to achieve their goals
- Mentoring and supporting team members on domain specific technical areas
Key Skills:
- Electronics theory, including component knowledge and analogue and digital circuitry expertise.
- Board design including schematic capture, PCB layout using any enterprise software (Altium preferred) with focus on Design for manufacturing (DFM) principles.
- Experience with FPGA (Zynq RFSoC or similar platform) based designs for high speed and high data-rate digital signal processing applications.
- Strong knowledge of High-speed digital layout design practices (matched impedance, stack up and manufacturing restrictions) and experience using SI tools.
- Experience with digital communication interfaces (I2C, SPI, CAN, UART, USB, LVDS, Ethernet)
- Experience with Rigid, Flex and Rigid-Flex PCB design
- Strong debugging experience and fault identification
- Experience with lab equipment including oscilloscopes, logic analysers, multimeters, spectrum analyzers, VNAs, etc.
Preferred Skills:
Design for IPC-6012DS Class 3A or ECSS-Q-ST-70-12C/60C compliance
Experienced in High power electronic design and thermal management.
SI tools experience like Hyperlynx or equivalent.
Experience with satellite communication systems, including environmental and component reliability requirements
Knowledge of the physical, link and network layers for wireless communication modules
RF modem design and implementation (QPSK, APSK, 16APSK, QAM)
Design for FPGA Programming (Verilog, VHDL)
Embedded and DSP programming (C/C++, Microcontrollers, DSP)
RF theory and circuit design (Basic link budgets, antennas, analogue frontends, digitization, materials/stackups, layout etc)
EMI/EMC testing experience with use of shielded and anechoic chambers
Spire operates a hybrid work model, and this position will require you to work a minimum of three days per week in office.
Access to US export controlled software and/or technology may be required. #LI-DC1
Spire is Global and our success draws upon the diverse viewpoints, skills and experiences of our employees. We are proud to be an equal opportunity employer and are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, marital status, disability, gender identity or veteran status.
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