Adresse
Form der ArbeitAbout the role
The experienced candidate with suitable skills is required to carry out key tasks and to meet the deadline of the project. The successful candidate will lead power Module Design concept definition in collaboration with multi- functional team and material vendors.
What you will do
- Responsible for leading the power Module Design team to develop the cutting-edge power semiconductor products for the applications in EV/HEV, industry and consumers, etc.
- Building Module Design platform for IGBT and WBG power Module Design and process development to meet customer requirement in a manufacturable and cost-effective way
- Responsible for module structure/mold/fixture design review and new project technical data collection.
- Customized module technical scheme, realized 3D structure according to requirements, exported engineering drawings, verified and optimized the structure of fixture and module parts.
- Responsible for the tooling, fixture, and automation design of new product development in the early stage.
- Power module circuit/structure design, chip selection design, life design, reliability verification and failure analysis.
- Creating and maintaining design rules and generation rules when required using controlled procedures
- Collaborating with multiple groups within and outside of CDC to deliver results on-time
- Publishing papers in international peer reviewed journals and/or presenting research results/findings in international conferences
- Coaching junior team member(s) in device design and process development
What you will need
- Hard Skills:
- More than 6-10 years’ experience in power Module Design, CAD modeling, finite element simulation, etc.
- Experience/familiar with packaging process, design and verification methods (e.g. vacuum soldering, low temperature Ag sintering, wire bonding, lead bonding, planar packaging, etc.)
- Familiar with power module development machine test process, part design.
- Knowledge of the challenges of advanced Module Design/ processing and the requirements of new materials
- Understanding of semiconductor device fabrication and assembly technology, also with knowledge in semiconductor device physics, preferably IGBT and/or SiC MOSFET.
- Experience in SiC Module Design and process is preferred.
- Proficient in reading English literature and writing in English.
- Soft Skills:
- Leadership skills in building and leading project teams in a global, intercultural environment– “exemplified engagement”.
- Master’s degree or above, Major in power electronics, material engineering, microelectronics, electrical engineering, etc.
- Good communication skills in both oral and written English.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
Nexperia is an Equal Opportunity/Affirmative Action Employer.
